Quality Control

Common communication protocols in the Internet of Things

What is a silent voice interface?

Based on customer request, we can do packaging before parts are shipped. Delievery service is also available from mainland China to our HK drop-off site, and from HK to USA and Europe. (custome documents and other files necessary will be attached with shipment according to FEDEX,UPS,DHL policy.)

​The implementation of RoHS compliance requirements has caused some major impacts on the supply chain. Some manufacturers did not change their part number when parts where transferred from SnPb alloy to Lead Free. This means that a grea area exists in what terminnations' parts actually are. Our XRF analysis facility (RoHS testing lab) allows a nondestructive method to determine what alloy a termi

Key Function Test

Pin correlation Test: Device Pin Characteristics Correlated to Manufacture Datasheet specified pin Descriptions. With use ofCurve Tracer this verifies Device's Pin out and check's for damage to devices via Opens/Shorts Test.

The aim of this destructive test is to demonstrate that the internal materials, design, construction and assembly of EEE parts are in accordance with the applicable acquisition document. This test can also be performed to examine unsealed devices prior to capping to verify that no damage and/or defects have appeared as a result of prior testing (see Pre-cap Inspection). It is intended principal

ICBROS Decapping removes thebody of the device through a safely controlled chemical process exposes the actual die structure of the component, including the bond wire in many cases. Although decapsulation is a destructive test, under high powered microscopy, we can normally view critical information on the die, such as the manufacturers name, the manufacturers logo and part number ect.