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Home News Discussion on the integrated solution of...

Discussion on the integrated solution of "semiconductor" photonics

Photonics can promote the semiconductor industry to advance at the "speed of light".

The photonics revolution is in full swing. Photonics was originally a behind-the-scenes technology, which was deeply hidden in the infrastructure of submarine and optical fiber communication - but since the beginning of the 21st century, optical fiber to the home, high-speed data communication, 3D sensing in smart phones and portable devices, and laser radar (LiDAR) solutions for autopilot have been growing steadily. These technologies take photonics as a part of their architecture. Their popularity, especially in consumer equipment, has created momentum for the development of optics in the optoelectronics industry.
In order to meet the needs of artificial intelligence (AI), the importance of photonics based processing is rapidly increasing.
As Shen Yichen, the co-founder of Lightintelligence, said: "In about 2015, Moore's Law began to fail - although the transistor is still getting smaller, the performance gains from continuous miniaturization are not as good as before. More importantly, it takes longer and longer to develop the next generation of smaller devices."

People urgently need disruptive technology.

The growing demand for autonomous vehicle shows the need to improve computing power. As automobile manufacturers face the growing demand of customers for improved automation, chip manufacturers are turning to photonics. At first, it brought the adaptive cruise control function of liberating both feet, then the auxiliary camera and proximity detection function of liberating both eyes, and the off-hand driving function recently developed with the vehicle moving towards fully automatic driving.
This development requires a large number of photonics components. Photonics technology can accurately and quickly monitor the area around you. The use of photonics based sensors can realize the real-time transmission of data, enabling the vehicle to remind the driver of potential hazards near, including pedestrians or other vehicles.
Consumers said that they would like to use more autonomous driving technologies in their vehicles - so much so that a market research report by Fortune Business Insights predicted that the global autonomous vehicle market would grow from 1.64 billion dollars in 2021 to 11.03 billion dollars in 2028.
Highlights of the report include: "The rapid improvement of sensor processing technology, high-definition map, adaptive algorithm, and the development of infrastructure to vehicle and vehicle-to-vehicle communication technology are encouraging many companies to expand their production capacity and promote vehicle automation to a new level."
Achieving a new level will require microchip manufacturers to turn to photonic integrated circuits (PIC). What can PIC bring to cars, and what advantages can they bring to data centers, wearable devices, medical technology, etc. in terms of transmission speed?
PIC can replace the traditional methods of assembling and integrating electronic and photonics components. These methods are outdated and expensive in terms of capital and labor. Using PIC can significantly save cost and assembly time. But for many chip manufacturers, compared with standard silicon, the materials that make up most photonics devices are very special and difficult to manufacture, and standard silicon is the material that the chip industry invests a lot and hopes to continue to support. Materials used in photonics are mainly used for LED, detector, sensor and imaging equipment.
However, according to a recent market research report by Skyquest Technologies, the global photonics market is expected to grow from $722 billion to $1.2 trillion by 2028. This expansion is due to the gradual realization that the traditional methods of semiconductor and optoelectronic industries will not be effective for a long time.
What the market needs is an integrated solution to produce chip-level devices with "semiconducting" photonics - using a complete wafer level semiconductor process. Only through this method can hundreds of millions of devices be produced, while reducing their cost, size and power requirements.
1.6T Rx OE - pluggable solution of POET Technologies (expandable to 1.6 Tbit/s and above)
By adding optical devices to communicate with each other and with electronic devices on a single chip, POET Technologies has improved the traditional electrical interposer widely used for inter-chip electrical communication.
POET clamps optical waveguides between electrical connections to provide integrated photonics solutions for the semiconductor industry. The platform of POET is based on the company's proprietary optical interposer. This device is only produced by the CMOS compatible wafer manufacturing method, and uses the standard high-resistivity silicon substrate to realize high-speed communication between all electronic and optoelectronic components on a single chip. All kinds of components (such as lasers, detectors, modulators, photodiodes, drivers, etc.) are flip chip and bonded to the optical intermediate layer. Known good components are selected to adapt to specific applications. Therefore, this integration is "hybrid" in nature. Last year, the company announced that Lumentum's high-speed direct modulation laser (DML) was added to its product design. It also uses Broadcom's continuous wave (CW) laser and incorporates the best in class components in its design.
The key of POET's optical intermediate layer structure and the assembly and test using traditional semiconductor devices is its low loss waveguide. The material loss of the waveguide characterized by the prism spectrum is less than 0.3 dB/cm, which is about an order of magnitude higher than that of the typical small-core silicon waveguide used in other silicon photonics technologies. In addition, the waveguide is mainly non-thermal (dn/dT=12pm/° C) and non-birefringent. They designed a special spot size converter for chip end fiber coupling, which can achieve 0.25 dB end coupling loss.
POET optical intermediary engine
The addition of these patented waveguide layers on traditional semiconductor wafers is critical to the realization of wafer level integration of electronic and optoelectronic components. This integration enables the optical engine of 100G to 1.6Tbit/s communication to achieve the world's smallest chip-level package. At 4.5 × On the size of 9 mm, the POET optical engine consists of four DMLs, four high-speed photodetectors, four monitoring photodiodes and a pair of multiplexers/demultiplexers. It also reduces the total material cost, which is an attractive feature, especially after the supply chain shortage in the past two years. The device is so small that the transceiver module manufacturer can install four engines in a standard QSFP-DD module, and the data rate can be increased by four times under a given panel density.
The initial customers of these first integrated photonics chips and AI-ML accelerator chips built with POET optical intermediate layer include mature chip manufacturers and start-up companies. They believe that hybrid integrated optoelectronic solutions are critical to providing advanced performance to customers and end users.
Photonics is the best and most feasible way for the industry that pursues data and connectivity. It is not difficult to understand why this industry is predicted to be one of the fastest growing technology fields in the next few years.
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